Since the technology is going to develop further, the devices are getting smaller and have a high power density. Due to the device’s size and power, the thermal management is a hot issue in the microelectronics industry. Conventional air cooling methods are ineffective at the high heat fluxes (Up to 100 W/cm^2). For that reason, many researchers are interested in the phase change heat transfer such as thin-film evaporation in thermal management of microelectronics devices. Using the high latent heat of vaporization, heat transfer rate increases with small temperature difference.
MEL designs the various wick material and structures to increase heat transfer rate, capillary performance such as dual height superhydrophilic micropost.